JPH087624Y2 - マーク付き半導体装置 - Google Patents
マーク付き半導体装置Info
- Publication number
- JPH087624Y2 JPH087624Y2 JP9989889U JP9989889U JPH087624Y2 JP H087624 Y2 JPH087624 Y2 JP H087624Y2 JP 9989889 U JP9989889 U JP 9989889U JP 9989889 U JP9989889 U JP 9989889U JP H087624 Y2 JPH087624 Y2 JP H087624Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- aluminum
- wiring
- contact hole
- function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 58
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 55
- 229910052782 aluminium Inorganic materials 0.000 claims description 55
- 238000007740 vapor deposition Methods 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9989889U JPH087624Y2 (ja) | 1989-08-29 | 1989-08-29 | マーク付き半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9989889U JPH087624Y2 (ja) | 1989-08-29 | 1989-08-29 | マーク付き半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0339830U JPH0339830U (en]) | 1991-04-17 |
JPH087624Y2 true JPH087624Y2 (ja) | 1996-03-04 |
Family
ID=31648930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9989889U Expired - Lifetime JPH087624Y2 (ja) | 1989-08-29 | 1989-08-29 | マーク付き半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH087624Y2 (en]) |
-
1989
- 1989-08-29 JP JP9989889U patent/JPH087624Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0339830U (en]) | 1991-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4916514A (en) | Integrated circuit employing dummy conductors for planarity | |
US9245851B2 (en) | Semiconductor device and method of manufacturing semiconductor device | |
EP0756333B1 (en) | Photodetector element containing circuit element and manufacturing method thereof | |
JP3171134B2 (ja) | 抵抗トリミング用アライメントマークを有する半導体装置 | |
KR940012650A (ko) | 반도체 소자의 콘택제조방법 | |
JPH087624Y2 (ja) | マーク付き半導体装置 | |
KR900019127A (ko) | 반도체 장치 및 제조방법 | |
US20230402474A1 (en) | Electronic device and method of manufacturing thereof | |
JP2013038311A (ja) | 認識マーク及び当該認識マークを用いた半導体装置 | |
JPH11135391A (ja) | 半導体集積回路及びその製造方法 | |
JP2871324B2 (ja) | 半導体装置 | |
JP2005166900A (ja) | 半導体装置及びその製造方法 | |
US5331733A (en) | Method for manufacturing a connection device for a semiconductor device | |
KR0155837B1 (ko) | 반도체 장치의 패드 및 그 제조방법 | |
KR100552289B1 (ko) | 반사형액정표시장치및그제조방법 | |
JPH04150043A (ja) | 半導体装置 | |
JP4182474B2 (ja) | 圧力センサおよびその製造方法 | |
JP3245894B2 (ja) | 半導体ウエハ | |
JPH0237708A (ja) | 半導体集積回路装置 | |
JP4182473B2 (ja) | 圧力センサ | |
JPS62219639A (ja) | 半導体装置の製造方法 | |
JPH02138434U (en]) | ||
JPH01162349A (ja) | 半導体装置の製造方法 | |
JPS6054468A (ja) | 半導体集積回路装置の製造方法 | |
JPH0434955A (ja) | 集積回路装置 |